尚豐科技向用戶提供專業的的電子束感生電流分析系統EBIC
EBIC原理
當掃描電鏡電子束作用于半導體器件時，如果電子束穿透半導體表面，電子束電子與器件材料晶格作用將產生電子與空穴。這些電子和空穴將能較為自由地運動，但如果該位置沒有電場作用，它們將很快復合湮滅（發射陰極熒光），若該位置有電場作用（如晶體管或集成電路中的pn結），這些電子與空穴在電場作用下將相互分離。故一旦在pn結的耗盡層或其附近位置產生電子空穴對，空穴將向p型側移動，電子將向n型側移動，這樣將有一靈敏放大器可檢測到的電流通過結區。該電流即為電子束感生電流（EBIC）。由于pn結的耗盡層有很多的多余載流子，故在電場作用下的電子空穴分離會產生很高的電流值，而在其它的地方電流大小將受到擴散長度和擴散壽命的限制，故利用EBIC進行成像可以用來進行集成電路中pn結的定位和損傷研究。
EBIC應用領域包括但不限于：
1）材料晶格缺陷探測分析，缺陷以黑點和黑線標識出來；
2）P-N結缺陷區域定位；
3）雙極電路中導致集電極-發射極漏電電流的收集管路的探測；
4）探測額外連接或者多層摻雜；
5）確定靜電放電/電過載（ESD/EOS）導致的失效位置；
6）測量減壓層/耗盡層（depletion layer）寬度和少數載流子擴散長度和時間（minority carrier diffusion lengths/lifetimes）
等等。
EBIC圖像對于電子-空穴的重新組合非常敏感，因此EBIC技術能夠非常有效的對半導體材料缺陷等進行失效分析。
BenifitsMake the link between device characterization and materials properties
Image electrical activity across complete devices
Distinguish between electrically active and passive defects
Correlate electrical activity with composition (EDS) and crystallographic structure (EBSD)
Localise electrical defects with highest resolution
Enable sample preparation for TEM or atom probe microscopy
Avoid alignment errors by directly imaging defects with EBIC in FIB SEM
Use live EBIC imaging to stop milling during sample preparation
Map junctions and defects over large areas
Identify all electrically active defects
Map active areas of junctions and electrical fields
Validate doping profiles and areas
Export calibrated EBIC signal for analysis of materials properties
Measure defect contrast / recombination strength
Extract diffusion length of minority charge carriers
Determine width of depletion regions
Verify device operation modes with built-in biasing and live overlay
Image junctions and fields in delayered devices
Map electrical activity in solar cells under bias
Compare imaged behaviour with device modelling
Access third dimension with depth profiling
Manipulate depth of EBIC signal by changing kV in SEM
Investigate EBIC images of cross-sections in FIB-SEM
Export EBIC depth series for 3D reconstruction
FeaturesThe EBIC system is fully integrated and software controlled
Image acquisition and EBIC module are integrated into one software
All amplification and acquisition settings are software controlled
EBIC signal is automatically quantified and displayed in current values (μA, nA, pA)
The most sophisticated and easy to use EBIC amplifier
Two stage amplification for maximum gain range
Built in -10…+10V DC bias with current compensation
Beam current output for SEM feedback and integration
The most powerful and versatile SEM scanning system – DISS5
Integrated scan generator and image acquisition
Very large image resolution, up to 16k x 16k pixels
Very fast scanning speed, down to 200ns dwell time
Simultaneous 4x analogue and 12x digital counter inputs
Optional electrical sample holder for large area devices
Suitable for solar cells, photovoltaics and light emitting diodes
Flexible mount in plan-view or cross-section configuration
Includes Faraday cups for beam current measurements
Advanced controls are provided for calibration, biasing and scanning
Flexible pre-amplifier gain from as little as 10^3 to as high as 10^10 V/A
Further 0.1…100x gain and 100 μA compensation for optimum imaging
Electronics are optimised for high speed, providing 0.5 MHz at 10^9 V/A
Simultaneous signals are mixed live for correlative microscopy
Up to 4x simultaneous signals
12-bit digitization with signal integration (oversampling)
Live colour mixing tool for visualisation
Current-voltage (IV) tool is integrated for contacts and nanoprobing
Voltage output maximum range is -10…+10 V
Gain selection for current measurements is automatic
IV may also be used for device characterisation
Configurable scan profiles enable custom workflows for efficient use
Fast EBIC scan profile for alignment and navigation
High resolution EBIC scan profile for mapping and analysis
Simultaneous SE/EBIC scan profile for localization
Live signal monitor assists image acquisition and calibration
Live line scan signals are displayed for optimisation
Multiple live signals are displayed simultaneously
The gradation graph improves display of complex shadows
Advanced live scan tool enables advanced beam control
Select points, lines or areas from pre-scan images
Set number of points, step size, binning and averaging
Generate single or multiple diagrams
Export diagrams and/or raw data
Gallery
尚豐科技致力于引進推廣先進的材料、生物顯微觀測及微區分析儀器，向科研人員高附加值服務。我們擁有一支涉及眾多領域高素質的應用支持團隊，為各行業的應用需求提供專業的解決方案和售后服務。
敬請聯絡
尚豐科技（香港）有限公司
